发明名称 |
Method for mounting a flip chip on a substrate |
摘要 |
The invention concerns a method for mounting a semiconductor chip with bumps on one surface onto a substrate location of a substrate, whereby the bumps are brought into contact with corresponding pads on the substrate location. Reference marks are attached to the bondhead that enable measurement of the actual position of the semiconductor chip as well as measurement of the actual position of the substrate location in relation to a system of coordinates defined by the reference marks. Positional displacement of the individual components of the assembly machine caused by thermal influences can be compensated without perpetual calibration procedures having to be carried out.
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申请公布号 |
US7597234(B2) |
申请公布日期 |
2009.10.06 |
申请号 |
US20060644445 |
申请日期 |
2006.12.22 |
申请人 |
OERLIKON ASSEMBLY EQUIPMENT AG, STEINHAUSEN |
发明人 |
BLESSING PATRICK;GRUETER RUEDI;WERNE DOMINIK |
分类号 |
B23K31/12;H01L21/00 |
主分类号 |
B23K31/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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