发明名称 METHOD FOR MANUFACTURING THERMOELECTRIC ENERGY CONVERSION MODULE HAVING IMPROVED BONDING CHARACTERISTICS
摘要 PURPOSE: A micro thermoelectric conversion method for manufacturing module is provided to form the dummy pattern for a bonding and to enhance the bonding characteristic. CONSTITUTION: The micro thermoelectric conversion method for manufacturing module comprises as follows. The n-type semiconductor pattern is mutually faced to first substrate and the second substrate. The thermoelectric conversion element part(A) is formed by bonding the p-type semiconductor pattern and n-type semiconductor pattern serially by π-type. The dummy pattern for improving the bonding characteristic near the thermoelectric conversion element part of the first substrate or the second substrate is formed.
申请公布号 KR20090104505(A) 申请公布日期 2009.10.06
申请号 KR20080029954 申请日期 2008.03.31
申请人 KOREA INSTITUTE OF MACHINERY & MATERIALS 发明人 HAN, SEUNG WOO;CHOI, HYUN JOO;KIM, OOK JOONG
分类号 H01L35/00;H01L35/28;H01L35/32 主分类号 H01L35/00
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