发明名称 |
METHOD FOR MANUFACTURING THERMOELECTRIC ENERGY CONVERSION MODULE HAVING IMPROVED BONDING CHARACTERISTICS |
摘要 |
PURPOSE: A micro thermoelectric conversion method for manufacturing module is provided to form the dummy pattern for a bonding and to enhance the bonding characteristic. CONSTITUTION: The micro thermoelectric conversion method for manufacturing module comprises as follows. The n-type semiconductor pattern is mutually faced to first substrate and the second substrate. The thermoelectric conversion element part(A) is formed by bonding the p-type semiconductor pattern and n-type semiconductor pattern serially by π-type. The dummy pattern for improving the bonding characteristic near the thermoelectric conversion element part of the first substrate or the second substrate is formed.
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申请公布号 |
KR20090104505(A) |
申请公布日期 |
2009.10.06 |
申请号 |
KR20080029954 |
申请日期 |
2008.03.31 |
申请人 |
KOREA INSTITUTE OF MACHINERY & MATERIALS |
发明人 |
HAN, SEUNG WOO;CHOI, HYUN JOO;KIM, OOK JOONG |
分类号 |
H01L35/00;H01L35/28;H01L35/32 |
主分类号 |
H01L35/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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