SEMICONDUCTOR DEVICE PACKAGE

摘要

PURPOSE: A semiconductor package is provided to replace the complicated process of a wire bonding by using the substrate of the silicon-based material as the signal substrate. CONSTITUTION: The semiconductor package includes the first semiconductor device(200A,200B) and the first substrate(100B). The first substrate includes the first and second major surfaces(110,120) and the substrate body layer(130). The substrate body layer is formed by the silicon-based material. The first semiconductor devices are formed in the first major surface. Therefore, the complicated process of a wire bonding can be replaced.