| 摘要 |
<p>PURPOSE: A plating solution for partially plating containing gold is provided to make the conductivity of gold plating solution lower than 50,000 micron without degrading the stability of the gold salt in the plating solution during plating. CONSTITUTION: A plating solution(5) for partially plating containing gold is made of cyanide gold salt, conducting salt and additive. The conductivity of the plating solution is 20,000~50,000 micron when being measured at temperature 25°C. The pH of the plating solution is the range of 3.5~6.0. The cyanide gold salt contains amino acid 10~100g/l and conducting salt 10~100g/l. Moreover, 0.1~1 g/l of cobalt salt is contained. The cobalt salt is cobalt sulfate, the cobalt chloride, the cobalt carbonates, the sulfamic acid cobalt, the phosphoric acid cobalt, and the citric acid cobalt or the gluconic acid cobalt.</p> |
