COMPLEX SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

摘要

PURPOSE: A complex semiconductor package and method of fabricating the same are provided to increase the number of the output terminal and to achieve miniaturization. CONSTITUTION: The complex semiconductor package(300) includes the second package(200) and the first package(100). The first packages include the first packaging substrate(110), the first semiconductor chip(120), and the first sealing member(330). The first semiconductor chips are placed in the first packaging of the substrate. The first sealing members are placed in the first packaging of the substrate to cover the first semiconductor chips. The second packages include second semiconductor chips. The second packages are arranged within the first sealing members.