| 摘要 |
PURPOSE: A light emitting diode package is provided to prevent overflow of molding material by a groove portion formed in the upper end of the package body. CONSTITUTION: A light emitting diode package(2) comprises a package body(21), a first lead frame(22), a second lead frame(23), a LED chip(24), and a groove portion(212). The package body has a cavity(25). The first lead frame and the second lead frame has a gap in the bottom of the cavity, and the other side is extended to the outside of the package body. The LED chip is mounted on the first lead frame. The groove portion is formed between the periphery of a cavity and package body. The groove portion is formed to expose the first lead frame and the second lead frame from the upper side of the package body. The groove portion has a width which is wider than the width of the first lead frame and the second lead frame. The groove portion is hardened after the first resin is filled. |
