| 摘要 |
PURPOSE: A semiconductor device is provided to allow a wide selection of a resin and obtain excellent adhesion of a substrate and the resin. CONSTITUTION: A semiconductor device(10) includes a first region(40), a second region(50), a semiconductor substrate(12), a plurality of pads, a plurality of outer connectors(32), a first resin portion(34), and a second resin(46). The first region is adjacent to the outer side of the first region, and the semiconductor substrate has the main surface and a side(42). The main surface is positioned in the first region, and the side is placed in the interface of the first region and the second region. The plural pads are formed on the main surface of the semiconductor substrate. |
