| 摘要 |
A method and apparatus for cleaving bonded substrates utilizes tensile force applied to the bonded substrates from an arm, in combination with a blade to initiate local cleaving. Upon sensing a drop in the load on the arm following initiation of the local cleaving, movement of the arm by a motor is carefully controlled to reduce the load, such that a speed of subsequent global cleaving substantially matches the speed of the initial local cleaving. A tool for performing this cleaving may include a suction member configured to secure a first bonded substrate to a base, an arm having a first end configured to pivot about the base, and a second end having a suction member configured to contact the second bonded substrate. A motor applies force to the arm that is translated into tensile force applied across the bonded wafer pair. The motor is configured to move the arm in a carefully controlled manner to reduce the applied tensile force once cleaving has been initiated with a blade.
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