WIRE BONDING MONITORING APPARATUS AND WIRE BONDER AND METHOD FOR MONITORING BONDING HEIGHT OF WIRE BALL

摘要

PURPOSE: A wire bonding monitoring apparatus and a wire bonder and a method for monitoring bonding height of a wire ball are provided to monitor whether the height of wire ball boned with a chip pad is a range of a reference bonding height or not. CONSTITUTION: A wire bonding monitoring apparatus includes a measurement apparatus and a controller(220). The measurement apparatus measures the bonding height of the wire ball bonded on the top surface of the chip pad(50). A controller is electrically connected to the measurement apparatus, and a controller judges whether the bonding value is between the range of the reference value or not. The wire bonding machine includes a bonding tool(100) and a wire bonding monitoring apparatus.