发明名称 Ni-P layer system and process for its preparation
摘要 <p>The invention relates to a layer system comprising on a substrate , the surface of which has been electropolished, (i) a Ni layer having a thickness ‰¤ 3.0 µm, (ii) a Ni-P layer having a thickness ‰¤ 1.0 µm, (iii) a Au layer having a thickness ‰¤ 1.0 µm.</p>
申请公布号 EP2103712(A1) 申请公布日期 2009.09.23
申请号 EP20080005350 申请日期 2008.03.20
申请人 ATOTECH DEUTSCHLAND GMBH 发明人 BARTHELMES, JÜRGEN;RÜTHER, ROBERT;KURTZ, OLAF;DANKER, MICHAEL
分类号 C23C18/44;C25D5/14 主分类号 C23C18/44
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