发明名称 |
Method of copper precipitation in lead-free solder, granulation and separation of (CuX)6Sn5 compounds and recovery of tin |
摘要 |
The purpose of the present invention is to separate excess coppers leached out in a lead-free solder bath and recover tin with high efficiency. An element X for forming a (CuX)6Sn5 compound between copper and tin in molten lead-free solders is added to separate out a (CuX)6Sn5 compound. Tin is recovered by binding the (CuX)6Sn5 compound by passing thereof through a multi-perforated plate, further generating swirling currents to precipitate and separate the bound (CuX)6Sn5 compounds and removing thereof.
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申请公布号 |
US7591873(B2) |
申请公布日期 |
2009.09.22 |
申请号 |
US20060995955 |
申请日期 |
2006.07.25 |
申请人 |
NIHON SUPERIOR SHA CO., LTD. |
发明人 |
NISHIMURA TETSURO |
分类号 |
C22B9/02 |
主分类号 |
C22B9/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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