发明名称 |
METHOD AND DEVICE FOR ENCAPSULATING ELECTRONIC COMPONENTS, WHEREIN THE ENCAPSULATING MATERIAL IS COOLED |
摘要 |
The invention relates to a method for encapsulating electronic components mounted on a carrier, wherein a liquid encapsulating material comprising polymer after curing is cooled in forced manner. The invention further also comprises a mould part for applying in a device for encapsulating electronic components mounted on a carrier, and such a device.
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申请公布号 |
KR20090099520(A) |
申请公布日期 |
2009.09.22 |
申请号 |
KR20097011650 |
申请日期 |
2007.11.28 |
申请人 |
FICO B.V. |
发明人 |
ZIJL JOANNES LEONARDUS JURRIAN;MERKENS MARK ALEXANDER |
分类号 |
B29C45/14;B29C45/72;B29C70/72 |
主分类号 |
B29C45/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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