| 发明名称 |
Heat conductive silicone composition |
| 摘要 |
A heat conductive silicone composition contains (A) a silicone oil as the primary ingredient and (B) a heat conductive filler. Component (A) has silicon-bonded alkoxy, alkoxyalkoxy, alkenoxy, or acyloxy groups in the molecule. Component (B) is surface treated with component (A).
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| 申请公布号 |
US7592383(B2) |
申请公布日期 |
2009.09.22 |
| 申请号 |
US20050533849 |
申请日期 |
2005.10.24 |
| 申请人 |
DOW CORNING TORAY COMPANY, LTD. |
发明人 |
FUKUI HIROSHI |
| 分类号 |
C08K3/34;C10M169/02;C08K3/08;C08K9/06;C08L83/05;C08L83/07;C09K5/08;C10M107/50;C10M113/08;C10N10/06;C10N20/06;C10N30/02;C10N50/10;H01L23/36;H01L23/373 |
主分类号 |
C08K3/34 |
| 代理机构 |
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