THE PRINTED CIRCUIT BOARD FOR FLIPCHIP PACKAGE HAVING COPPER BUMP WITH TRIANGULAR PROFILE AND MANUFACTURING METHOD THEREOF

摘要

A PCB for mounting a flip-chip and a manufacturing method thereof are provided to reduce a manufacturing cost by forming a bonding bump through an etching and plating process. A substrate comprises an insulation layer and a copper foil layer. The substrate is drilled for interfacial connection(S1). First copper plating is performed on the copper foil layer of the substrate(S2). A first etching resist is formed on the copper foil layer of the substrate. A circuit pattern is formed by a first etching(S3). The first etching resist is removed from the copper foil layer of the substrate. A second etching resist is formed on the copper foil layer of the substrate in order to expose an electrode part for connecting a flip chip. A bottom side of the electrode part for connecting the flip chip is formed with a triangle shape by a second etching(S4). Second copper plating is performed on the electrode part for connecting the flip chip(S5). The second etching resist is removed from the copper foil layer of the substrate. Ni/Au plating is performed on the electrode part for connecting the flip chip(S6).