发明名称 |
Solid-state imaging device and method of manufacturing the same |
摘要 |
There are provided a semiconductor substrate 101 on which solid-state imaging devices are formed, and a translucent member 201 provided onto a surface of the semiconductor substrate such that spaces are provided to oppose to light receiving areas of the solid-state imaging devices, wherein external connecting terminals are arranged on an opposing surface of the semiconductor substrate 101 to a solid-state imaging device forming surface, and the external connecting terminals are connected to the solid-state imaging devices via through-holes provided in the semiconductor substrate 101.
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申请公布号 |
US7592200(B2) |
申请公布日期 |
2009.09.22 |
申请号 |
US20050165133 |
申请日期 |
2005.06.24 |
申请人 |
FUJIFILM CORPORATION |
发明人 |
MAEDA HIROSHI;NISHIDA KAZUHIRO;NEGISHI YOSHIHISA;HOSAKA SHUNICHI |
分类号 |
H01L21/00;H01L27/14;H01L23/04;H01L23/12;H01L27/146;H01L29/04;H01L29/20;H01L31/02;H01L31/0203;H01L31/036;H01L31/0376;H01L31/20;H04N5/225;H04N5/335 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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