WIRING BOARD HAVING SOLDER BUMP AND METHOD FOR MANUFACTURING THE SAME

摘要

A wiring board and a manufacturing method thereof are provided to improve connection reliability with the other component by equalizing the height of each solder bump even though the solder resist has a plurality of openings with different diameter. A metal layer is formed on a surface of a main body(12) of a wiring board. A plurality of openings exposes the metal layer. A solder resist is formed on the surface of the main body of the wiring board. The solder resist is formed on the surface of the main body of the wiring board. The plurality of solder bumps are positioned on the metal layer inside the plurality of openings. The plurality of openings are comprised of a first opening(31) and a second opening(32) larger than the first opening. A top part(43) of a solder bump(41) arranged in the first opening has a flat plane.