发明名称 Plated film of gold-cobalt amorphous alloy, electroplating bath, and method for electroplating
摘要 A gold-cobalt based amorphous alloy plated film consisting of a homogeneous amorphous phase not having microcrystals is formed by electroplating conducted by use of an electroplating bath containing a gold cyanide salt in a concentration of 0.01 to 0.1 mol/dm3 in terms of gold, a cobalt salt in a concentration of 0.02 to 0.2 mol/dm3 in terms of cobalt, and a tungstate in a concentration of 0.1 to 0.5 mol/dm3 in terms of tungsten. The gold-cobalt based amorphous alloy plated film obtained consists of a homogeneous amorphous phase not having microcrystals, and has an enhanced hardness while retaining the good contact resistance and chemical stability intrinsic of gold on such levels as to be free of problems on a practical use basis; therefore, the gold-cobalt based amorphous alloy plated film is effective for use as a contact material in electric and electronic component parts such as relays.
申请公布号 US7591911(B2) 申请公布日期 2009.09.22
申请号 US20060529537 申请日期 2006.09.29
申请人 KANTO KAGAKU KABUSHIKI KAISHA;WASEDA UNIVERSITY 发明人 SENDA KAZUTAKA;KATO MASARU;OSAKA TETSUYA;OKINAKA YUTAKA
分类号 C22C45/00 主分类号 C22C45/00
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