发明名称 Multilayer print circuit board
摘要 This invention effectively prevents potential fluctuation in the power supply terminal of a semiconductor device, that is, noise from flowing out to a main power supply wiring. A multilayer print circuit board includes a first power supply via hole which connects to the power supply terminal of a semiconductor integrated circuit on a first surface layer and extends from the first surface layer to a second surface layer, a ground via hole which connects to a ground conductive layer, extends from the ground conductive layer to the second surface layer, and connects to the first power supply via hole on the second surface layer through a bypass capacitor, a first clearance hole which is formed in a power supply conductive layer, and a second clearance hole which is formed in the ground conductive layer. The first clearance hole is larger than the second clearance hole.
申请公布号 US7594105(B2) 申请公布日期 2009.09.22
申请号 US20060566942 申请日期 2006.12.05
申请人 CANON KABUSHIKI KAISHA 发明人 OHSAKA TOHRU
分类号 H05K7/08;H01P5/02 主分类号 H05K7/08
代理机构 代理人
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