| 摘要 |
An LED package and a manufacturing method thereof are provided to reduce scattering of color coordinate of an LED package by regularly forming a height of filler in case many LED packages are manufactured. An LED chip is bonded in a loading part(11a). A barrier part(11b) is formed in both sides of the loading part. A base part(11) is formed by opening different both sides of the loading part. A filling part(12) is filled in a space formed by the barrier part and the loading part, and transmits a light emitted from the LED chip. An electrode part(13) is molded in the base part, is protruded to outside, and is connected to the LED chip. The barrier part includes a reflective film which reflects a light emitted in the LED chip. |
