| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor laser device capable of controlling a catastrophic optical damage (COD) caused by a photo output of the semiconductor laser device and a production process of the same, in regard to the semiconductor laser device in which the interface state of the interface between the semiconductor laser (oscillator) and a coating film is reduced by a simple method and the production process of the same. SOLUTION: A dangling bond termination film consisting of a lithium thin film or beryllium thin film is formed on the cleavage face of the semiconductor laser. Further, a coating film is formed on the dangling bond termination film. COPYRIGHT: (C)2009,JPO&INPIT
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