| 摘要 |
<p>Disclosed is a curable epoxy composition which can be quickly cured at low temperatures. When the curable epoxy composition is used for connection of a member to be connected, the member can be efficiently connected by the composition. The curable epoxy composition contains an epoxy component and a curing agent, and the epoxy component includes a monomer of an epoxy compound having a structure represented by formula (1), a polymer wherein at least two of the epoxy compounds are bonded, or a mixture of the monomer and the polymer. (1) In the formula (1), R1 and R2 each represents an alkylene group having 1-5 carbon atoms; R3 represents a hydrogen atom, an alkyl group having 1-5 carbon atoms or a structure represented by formula (2); and R4 represents a hydrogen atom, an alkyl group having 1-5 carbon atoms or a structure represented by formula (3). (2) (3) In the formula (2) and formula (3), R5 and R6 each represents an alkylene group having 1-5 carbon atoms.</p> |
