发明名称 |
SENSOR MODULE WITH STRESS ISOLATED TEMPERATURE COMPENSATION AND METHOD OF MANUFACTURE |
摘要 |
<p>A sensor module includes a substrate, means for sensing strain applied to the substrate, means for sensing temperature to compensate for thermal effects on the strain-sensing means, and means for isolating the temperature-sensing means from the strain applied to the substrate and detected by the strain-sensing means. In particular, the strain isolation my be a trench etched around the resistive temperature sensor. Alternatively, the temperature sensor may be placed above the strain-sensing means carried by an intermediate film.</p> |
申请公布号 |
WO2009108230(A1) |
申请公布日期 |
2009.09.03 |
申请号 |
WO2008US84113 |
申请日期 |
2008.11.20 |
申请人 |
THE TIMKEN COMPANY;MCDEARMON, GRAHAM, F.;HUANG, XIANGXIANG |
发明人 |
MCDEARMON, GRAHAM, F.;HUANG, XIANGXIANG |
分类号 |
G01L1/18;G01K7/18;G01L1/20;G01L1/22 |
主分类号 |
G01L1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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