发明名称 DOUBLE-SIDED POLISHING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a double-sided polishing device capable of collectively polishing a large number of workpieces while efficiently utilizing the polishing surfaces of polishing tools and having such a structure that is simple and hard to produce consumable material. <P>SOLUTION: A workpiece holding means 40 comprises a rotating shaft part 41 installed around a lower polishing plate 20, an elliptic carrier 42 horizontally extending from the upper end of the rotating shaft part 41 in the direction of the lower polishing plate 20, and a workpiece holding hole 43 formed at the free end of the carrier 42. The carrier 42 is horizontally rotated between the upper and lower polishing plates 30, 20. When the carrier 42 is reduced in size, the number of workpieces to be processed can be increased, and the amplitude of the workpiece W can be increased. Consequently, the polishing surfaces of the polishing tools 22, 23 to be polished can be efficiently utilized. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009196012(A) 申请公布日期 2009.09.03
申请号 JP20080037936 申请日期 2008.02.19
申请人 DISCO ABRASIVE SYST LTD 发明人 SEKIYA KAZUMA
分类号 B24B37/04;B24B37/08;B24B37/30 主分类号 B24B37/04
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