| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed wiring board and a manufacturing method therefor, which can prevent a plating failure in a connection hole such as a via to be formed in the printed wiring board, thereby can enhance the connection reliability. <P>SOLUTION: The printed wiring board 100 includes a thermosetting resin sheet 16 (insulation layer) having a via hole 20 (through hole) configured with an inner wall whose taper angle varies depending on its part, a copper foil 17 (conductor layer) provided on the thermosetting resin sheet 16, and a wiring pattern 13 (wiring layer) which is provided so as to be exposed from the via hole 20 and is electrically connected with the copper foil 17 through the via hole 20. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
