| 摘要 |
PROBLEM TO BE SOLVED: To provide an environmentally friendly surface treatment method for copper, capable of ensuring adhesive strength between a copper surface and an insulating resin and improving various reliability performances without forming irregularity of >1,000 nm on the copper surface, the copper treated thereby, and a wiring board. SOLUTION: The surface treatment method for copper comprises: a step of discretely forming a metal nobler than copper on the copper surface; a subsequent step of oxidizing the copper surface with an alkaline solution containing an oxidizer to form copper oxide on the copper surface; and a subsequent step of dissolving the copper oxide with an acidic solution. COPYRIGHT: (C)2009,JPO&INPIT
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