| 摘要 |
Disclosed herein is a method of fabricating a capacitor of a semiconductor device that includes sequentially forming an interlayer insulating film defining a contact plug, a lower electrode oxide film, and a hard mask film over a semiconductor substrate; etching the hard mask film with a mask comprising a dummy pattern and a cell pattern to form a hard mask pattern wherein a first trench is formed in a dummy pattern region and a second trench is formed in a cell pattern region; forming a capping film that buries the first trench; and etching the lower electrode oxide film with the capping film and the hard mask pattern as a mask to form a lower electrode trench that exposes the contact plug.
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