| 发明名称 |
METAL POLISHING SLURRY AND CHEMICAL MECHANICAL POLISHING METHOD |
| 摘要 |
A metal polishing slurry which is capable of simultaneously realizing a high polishing speed and reduced dishing in the polishing of a subject to be polished is provided. The metal polishing slurry includes, an oxidizing agent; and an organic acid; and a compound represented by the following general formula (1):
|
| 申请公布号 |
US2009221145(A1) |
申请公布日期 |
2009.09.03 |
| 申请号 |
US20090394507 |
申请日期 |
2009.02.27 |
| 申请人 |
FUJIFILM CORPORATION |
发明人 |
INADA HIROSHI;YOSHIKAWA MASARU;INABA TADASHI |
| 分类号 |
H01L21/304;B24B37/00;C09K3/14;C09K13/00 |
主分类号 |
H01L21/304 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
