发明名称 LAMINATED ELECTRONIC COMPONENT MANUFACTURING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laminated electronic component manufacturing method facilitating removal of a green sheet laminate after pressed from a press mold without damage to the laminate and waste of material while conserving environment when removing the laminate from the mold and also facilitating automation. <P>SOLUTION: Among a plurality of green sheets constituting the laminate 4a, the adhesive force of at least one outer green sheet 14a1 in contact with a female mold 20 of the press mold is made weaker than those of other green sheets 14a2, 10a, 14a3, 14a4 laminated together with the outer green sheet 14a1. Then, the laminate 4a is pressed on the female mold 20 of the press mold and the pressed laminate 4a is removed from the press mold 25. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009200439(A) 申请公布日期 2009.09.03
申请号 JP20080043472 申请日期 2008.02.25
申请人 TDK CORP 发明人 IGUCHI TOSHIHIRO;YOSHII AKITOSHI;GOSHIMA AKIRA;HASEBE KAZUYUKI
分类号 H01G4/12;H01G4/30 主分类号 H01G4/12
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