发明名称 |
Conductive paste and multilayer printed wiring board using the same |
摘要 |
The present invention provides a conductive paste comprising flake conductive fillers having a 99% cumulative particle size of 25 mum or less and a binder resin as essential components. The flake conductive fillers are metal particles having a silver-copper alloy surface layer. The conductive paste according to the present invention is fused with a part of a copper foil circuit to which the conductive paste is to be connected during connection by heating and pressurization, and has high electrical conductivity and high fill ration in a via hole. Thus, the conductive paste according to the present invention provides a multilayer printed wiring board that has high reliability of connection and excellent interlayer connection.
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申请公布号 |
US2009220738(A1) |
申请公布日期 |
2009.09.03 |
申请号 |
US20060663450 |
申请日期 |
2006.05.18 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
OKA YOSHIO;TAKII HITOSHI;HAYASHI NORIKI |
分类号 |
H05K3/00;H01B1/22 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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