| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an optically-coupled semiconductor device enabling steady mass production and more preferably capable of increasing the insulation performance, to provide a manufacturing method thereof, and to provide an electronic apparatus equipped with the optically-coupled semiconductor device. <P>SOLUTION: The optically-coupled semiconductor device is composed of a light-emitting element 2 and a light-receiving element 3 respectively mounted on tips 1a2 and 1b2 of first and second lead frames 1a and 1b, and inner and outer packages 4 and 5 packing the light-emitting element 2 and the light-receiving element 3. The upper package portion 4a of the inner package 4 is formed narrower than the lower package portion 4b. Part of the lower package portion 4b and upper surface portions above the tips 1a2 and 1b2 are partially exposed without being covered with the upper package portion 4a. Resin formed portions 4c1, 4c2, 4c3 and 4c4 whose upper ends are as high as the top surface of the boundary portions P1 and P2 between the tips 1a2 and 1b2 and the main parts 1a1 and 1b1 are formed on part of the exposed portions. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
