ELECTRIC CONTROL UNIT AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To miniaturize an entire device by packaging various kinds of electronic components to both the sides, and to secure satisfactory permeability. SOLUTION: A first electric circuit board 12 to which an electronic component for a high voltage and first connectors 34a-34c are packaged is arranged opposite to a second electric circuit board 14 to which an electronic component for a low voltage and a second connector 46 are packaged. Substrate dimensions W1 in a width direction orthogonally crossing the axial direction of the first electric circuit board 12 are set smaller than substrate dimensions W2 in a width direction orthogonally crossing the axial direction of the second electric circuit board 14 (W1