| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a conduction cooled circuit board structure suitable for dissipating plenty of heat generated by a high-output PCB. <P>SOLUTION: This conduction cooled circuit board structure 102 may include a frame 104, and at least one circuit board 106 attached to the frame 104, and having at least one cooling target area 130. The structure 102 may also include: at least one rail 132 attached to the frame 104; and at least one heat pipe 124 having a first end and a second end, wherein the first end is disposed near the area 130 and the second end contacts the rail 132 to transfer heat from the area 130 to the rail 132. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
