发明名称 Pad dresser, polishing device, and pad dressing method
摘要 Elastic member bundled by pencil band is mounted to the lower edge of support part. Elastic member is composed with tungsten wires which are 25 mm in the length and 0.15 mm in diameter bundled with every 30 wires in one bundle. The tip part of each element wire of elastic member contacts polishing pad with the tip end cut round and performs dressing of polishing pad. The wire size of the tip part of each element wire of elastic member is made to be fine and the cutting width on polishing pad is made to be narrow, and at the same time, the rigidity of elastic member is made to be enhanced by bundling each element wire of elastic member with pencil band, and a large pressure is made to be pressed to the fine tip part of each element wire. Therefore, the tip part of elastic member can give an effective incision depth to polishing pad.
申请公布号 US2009221216(A1) 申请公布日期 2009.09.03
申请号 US20090322922 申请日期 2009.02.09
申请人 TOKYO SEIMITSU CO., LTD. 发明人 FUJITA TAKASHI
分类号 B24B53/017;B24B53/02;B24B53/095;B24B53/12;H01L21/304 主分类号 B24B53/017
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