METHOD AND SYSTEM FOR MODELLING SIGNAL INTERACTIONS IN AN ELECTRONIC PACKAGE

摘要

A method and system for modelling signal interactions in a finite sized three-dimensional electronic package. The method comprises the steps of a) using a parallel-plate radial waveguide model to represent two parallel conductor planes of the package and one or more vias of a substrate layer sandwiched between said two conductor planes; b) representing a boundary of the package as a plurality of cylinders each extending between said two conductor planes at a periphery thereof and having perfect magnetic conductor properties; c) modeling wave interactions in the package using a scattering matrix method (SMM) technique; and d) calculating an admittance matrix for modeling the signal interactions.