| 摘要 |
PROBLEM TO BE SOLVED: To provide a low-temperature baked laminated ceramics substrate capable of providing a high-density and low-resistance-loss wiring pattern with a simple manufacturing process, and small in time required for processing; and its manufacturing method. SOLUTION: This low-temperature baked laminated ceramics substrate is provided with: a ceramics substrate 11 containing alumina and borosilicate glass as main constituents, and baked at low temperature; a first via hole 12 formed on the ceramics substrate; a filled conductor 13 filled in the first via hole; an insulation film 15 formed on a surface of the ceramics substrate and formed of a polyimide resin or the like; a second via hole 16 formed on the insulation film 15 in a part just above the first via hole and having a small diameter relative to the first via hole; base films 17 formed by sputtering or the like by covering the inside the second via hole and the filled conductor; and metal thin film wires 18 formed on the base films 17 and comprising a plated layer of copper, nickel or gold. COPYRIGHT: (C)2009,JPO&INPIT |
