| 摘要 |
PROBLEM TO BE SOLVED: To provide a hollow type electronic component capable of preventing cracking even when a high-insulation substrate is used. SOLUTION: An element-side metal sealing portion 24 formed of a metal material on the side of one principal surface 20a of a substrate 20 for an element to enclose a periphery of an element portion 21 and a cap-side metal sealing portion 14 formed of a metal material on the side of an opposite principal surface 10a of a substrate 10 for a cap which is opposed to the substrate 20 for the element are joined together, and the element portion 21 is airtightly sealed. The substrate 20 for the element and the substrate 10 for the cap are made of high-insulation substrates having brittleness. A coefficient of one of the substrate 20 for the element and the substrate 10 for the cap is close to the coefficient of linear expansion of solder alloy formed at at least one of the element-side metal sealing portion 24 and cap-side metal sealing portion 14. COPYRIGHT: (C)2009,JPO&INPIT |
