| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor sealing which is excellent in burning resistance, fluidity, continuous moldability and solder resistance. SOLUTION: The epoxy resin composition for semiconductor sealing contains: (A) an epoxy resin having a structure expressed by general formula (1); (B) a compound having at least two phenolic hydroxy groups; (C) an inorganic filler; (D) a curing accelerator; and (E) a fatty acid triglyceride. COPYRIGHT: (C)2009,JPO&INPIT |
