| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor apparatus which can prevent the adhesion of a resin to an exposed part of a terminal to be connected with external wiring when forming a mold resin. SOLUTION: A terminal block 182 which is arranged at an interval in distance between a substrate 172 and a substrate 172 and wherein a through-hole is made from one substrate to the other substrate, and a control terminal 153 which is inserted into the through-hole and is projected from the terminal block 182 are prepared. A first mold wherein a first recess for the substrate 172 is formed and a second mold wherein a second recess for the terminal block 182 and a third recess for the control terminal 153 that is formed in the second recess and is projected from the terminal block 182 are prepared, and the substrate 172 is arranged in the first recess and the terminal block 182 is arranged in the second recess. Furthermore, the control terminal 153 is arranged in the third recess, and the opening of the second recess is blocked by the terminal block 182. The periphery of the terminal block 182 is pinched by the first and second molds, and a resin is put into between the substrate 172 and the terminal block 182, so as to form a mold resin 174 on the substrate 172. COPYRIGHT: (C)2009,JPO&INPIT
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