| 摘要 |
A method of producing an electronic component includes forming a film of a first metal above a substrate; converting partly the film of the first metal into a film containing a second metal by replacement of at least part of the first metal with the second metal; forming a film of a third metal above the film containing the second metal; and removing the film of the first metal other than the film containing the second metal by wet etching using the film of the third metal as a mask.
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