| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible wiring substrate on which a bump electrode is formed only on the upper surface of conductor wiring, and its manufacturing method. SOLUTION: The manufacturing method of the flexible wiring substrate is characterized by forming a photosensitive resin layer 3 on the whole surface of a film base 1 on the side where the conductor wiring 2 is provided, exposing an area other than a long hole-like pattern crossing the conductor wiring 2 and having the shape including an area where a conductor wiring is not formed on both sides of the conductor wiring, further irradiating the area with light from a surface on the side where the conductor wiring 2 is not formed of the film base 1 to expose the photosensitive resin layer 3 in an area where the conductor wiring 1 is not formed, after that, dissolving, removing an unexposed part of the photosensitive resin layer 3, and performing metal plating to a part of the exposed conductor wiring 2 to form the bump electrode 5. COPYRIGHT: (C)2009,JPO&INPIT |
