An LED package is disclosed herein. The disclosed LED package comprises a base having an LED chip mounted thereon, an encapsulation member formed by a light-transmittable resin to encapsulate the LED chip, and a housing formed to expose a top portion of the encapsulation member and to encompass a side surface of the encapsulation member, wherein the encapsulation member is formed by a transfer molding process using a mold to have a predetermined shape. Further, the housing may be light-transmittable.
申请公布号
WO2009072786(A3)
申请公布日期
2009.09.03
申请号
WO2008KR07103
申请日期
2008.12.02
申请人
SEOUL SEMICONDUCTOR CO., LTD.;LEE, CHUNG HOON;KIM, YOON HEE;PARK, BYUNG YEOL;KIM, BANG HYUN;SEO, EUN JUNG;KWON, HYOUK WON
发明人
LEE, CHUNG HOON;KIM, YOON HEE;PARK, BYUNG YEOL;KIM, BANG HYUN;SEO, EUN JUNG;KWON, HYOUK WON