| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve a problem that cracks or the like are generated because stress is applied to the front surface side of a semiconductor chip located under a bump resulting from a load applied to the bump. <P>SOLUTION: A conductive pattern (27) is formed on the front surface of a substrate (10). The bump (11) is electrically connected to the conductive pattern. The bump has a shape extended to a side area at the upper part of the conductive pattern. A buffering layer (30) formed of an organic material is arranged between a part extended to the side area of the bump and the conductive pattern. <P>COPYRIGHT: (C)2009,JPO&INPIT |
