| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high-frequency module which establishes electrical separation between grounding-use metal electrodes which form transmission paths based on a distributed parameter element and at least one of grounding-use metal electrodes which are formed on bottom surfaces of the plurality of cavity-structured concave portions containing semiconductor-including mounted components therein. <P>SOLUTION: The high-frequency wave module includes the transmission path based on the distributed parameter element, the transmission path being part of an input/output terminal, the plurality of cavity-structured concave portions 15 for containing semiconductor-including mounted components 16 therein, and the grounding-use metal electrodes, and uses dielectric substrates of at least two or more layers and semiconductors, wherein electrical separation is established between the grounding-use metal electrodes which form the transmission paths based on the distributed parameter element and at least one of the grounding-use metal electrodes which are formed on bottom surfaces of the plurality of cavity-structured concave portions 15 for containing the semiconductor-including mounted components 16 therein. <P>COPYRIGHT: (C)2009,JPO&INPIT |
