| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To downsize a device structure, and to improve work efficiency, in an adhesive tape sticking device sticking an adhesive tape to a ring frame and an electronic substrate such as a semiconductor wafer to hold the electronic substrate to the ring frame. <P>SOLUTION: This adhesive tape sticking device has a projecting arrangement formed of a horizontally-long rectangular part A and a projecting part B connected to the center part of the rectangular part A when viewing the device in a plan view. An adhesive tape sticking part 2 for sticking an adhesive tape DT to a ring frame (f) and a wafer W is arranged in the projecting part B; the wafer W, the ring frame (f) and a transport mechanism 1 transporting the wafer W held to the ring frame (f) are arranged in the rectangular part A; and an electronic substrate processing unit is connectably formed at least in either of two regions C and D adjacent to the rectangular part A by interposing the projecting part B. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
