| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid resin composition that is a liquid resin composition which can form a resin composition layer on a support by printing, is tack-free at room temperature after drying or drying and partially-hardening a liquid resin composition, is excellent in semiconductor element holding power after subsequently loading a semiconductor element and excellent in reliability such as solder cracking resistance with low elasticity after hardening; and to provide a semiconductor apparatus made therewith. SOLUTION: There are provided the liquid resin composition for adhering a semiconductor element containing an epoxy resin (A) having two or more epoxy groups in a molecule, a hardener (B) having two or more phenolic hydroxyl groups in a molecule, a solvent (C) and a filler (D) to the support, wherein the epoxy resin includes an epoxy resin (A1) having a dicyclopentadiene skeleton and a liquid epoxy resin (A2); and the semiconductor apparatus made therewith. COPYRIGHT: (C)2009,JPO&INPIT |
