发明名称 CONDUCTIVE RESIN MOLDING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a conductive resin molding material that exhibits high conductivity and has the improvement in conductivity variation such as the dependence of conductivity upon injection speed by solving such technical problems as the exhibition of high conductivity and the improvement of conductivity variation such as the dependence of conductivity upon injection speed involved in a conductive resin molding material containing a conductive filler, especially a conductive carbon nanomaterial which is typically represented by CNT. SOLUTION: The conductive resin molding material comprises 5-98.9 wt.% linear thermoplastic polymer (component A), 0.1-50 wt.% conductive filler (component B) and 1-45 wt.% macrocyclic oligomer (component C) in the case when the total of component A-component C is 100 wt.%. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009197056(A) 申请公布日期 2009.09.03
申请号 JP20080037468 申请日期 2008.02.19
申请人 TEIJIN CHEM LTD 发明人 IMAMURA KOICHI;YAMANAKA KATSUHIRO;KASHIMA KEIICHI
分类号 C08L101/00;B29C45/00;C08J3/22;C08K3/04;C08L67/02;C08L69/00;C08L71/12 主分类号 C08L101/00
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