发明名称 ZnO BASED SEMICONDUCTOR DEVICE, ITS MANUFACTURE METHOD AND OPTICAL SEMICONDUCTOR ELEMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a new ZnO based semiconductor device with improved moisture-proof. <P>SOLUTION: The ZnO based semiconductor device includes: a lamination structure including a first semiconductor layer containing the ZnO based semiconductor of a first conductivity type and a second semiconductor layer containing the ZnO based semiconductor of a second conductivity type opposite to the first conductivity type, formed above the first semiconductor layer and forming a pn junction together with the first semiconductor layer; and a Zn-Si-O layer containing the compound of Zn, Si and O and covering a surface exposing the pn junction of the lamination structure. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009200150(A) 申请公布日期 2009.09.03
申请号 JP20080038669 申请日期 2008.02.20
申请人 STANLEY ELECTRIC CO LTD 发明人 KOTANI TAIJI;SANO MICHIHIRO;KATO HIROYUKI;HORIO TADASHI;OGAWA AKIO;YAMAMURO TOMOFUMI
分类号 H01L33/06;H01L33/28;H01L33/40;H01L33/44;H01L33/56;H01L33/60;H01L33/62 主分类号 H01L33/06
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