| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve the problem that there is risks of peeling of an insulating layer, and breaking and peeling of a connection electrode in a process of manufacturing a substrate module. <P>SOLUTION: In the substrate module 1, the connection electrode 4 is provided on a first top surface 2a of a substrate 2, a first through-hole portion 5 penetrates the substrate 2 along the thickness to reach a backside of the connection electrode 4, and a through electrode 6 is provided in the first through-hole portion 5. The through electrode 6 has a recess 6a at a part opposed to the backside of the connection electrode 4, and an upper portion of the through electrode 6 is larger in thickness than a side portion of the through electrode 6. The through electrode 6 is provided even on a second top surface 2b of the substrate 2, and connected to a wiring electrode 7 on the second top surface 2b. An insulating layer 8 is provided on the second top surface 2b so as to cover a top surface of the wiring electrode 7, and also provided even in the recess 6a of the through-hole 6. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
