| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device including a heat transfer sheet which has sufficient heat transfer efficiency and can be easily manufactured. SOLUTION: The electronic device includes a circuit component 23, a heat sink which dissipates heat generated by the circuit component 23 to a periphery, and a first heat transfer sheet 43 and a second heat transfer sheet 44 which are provided adjacently between the circuit component 23 and heat sink and have heat conductivity for thermally connecting the circuit component 23 and heat sink. The second heat transfer sheet 44 has higher rigidity than the first heat transfer sheet 43 and also has a through-hole 45. The first heat transfer sheet 43 has higher heat conductivity and elasticity than the second heat transfer sheet 44, and enters the through-hole 45 to thermally connect the circuit component 23 and heat sink. COPYRIGHT: (C)2009,JPO&INPIT
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