| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package capable of shortening the time needed to examine a pattern. SOLUTION: The semiconductor package 1 includes a case 2 for storing a chip mounted with an integrated circuit and a plurality of pins electrically connected to the integrated circuit. The case 2 has a bottom surface portion 6 provided on a board, a top surface portion 7 having its internal wall opposed to the bottom surface portion 6, and a side surface portion 5 connected to the bottom surface portion 6 and top surface portion 7. On an external wall of the side surface portion 5, a side surface pin group 3 of pins which are some of the plurality of pins is provided. COPYRIGHT: (C)2009,JPO&INPIT
|
